Amendment 1 to Automatic Wire Bonder

AMENDMENT 1 TO SOLICITATION 1333ND26QNB030043 Due to Vendor Questions:

Vendor Question 1:

Can you let me know if the parts will be held on flat boats or manually placed on the workholder?

NIST Response:

The samples (chips) need to be wire bonder to a 256-pin ceramic package. This ceramic package needs to be affixed to the stage of the bonder for wire bonding.

Vendor Question 2:

Current Equipment: Are you currently using a manual wire bonder? If so, could you specify the make and model?

NIST Response:

No

Vendor Question 3:

Application: What type of bonding applications do you plan to run with the new wire bonder?

NIST Response:

We are looking to bond a 1 cm2 chip inside a 256-pin double-tiered ceramic package and streamline the process

Vendor Question 4:

Bonding Tools: Are there specific bonding tools or configurations required for your applications?

NIST Response:

You will find this information in the Statement of Work.

Vendor Question 5:

Accessories: Will you need additional items such as a microscope, work holders, or any other accessories?

NIST Response:

The tool should contain a scope for inspection and a way to fix the sample piece to the stage.

As described in the attached Combined Synopsis Solicitation, Statement of Work and Applicable Provisions and Clauses