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Notice ID: 17a64914677b438e91c8917bb33f18c3Award NoticeAwardedArchived

Award Notice for Micro specimens of electroplated copper films and micro-sized lead-free solder for mechanical testing to fracture

Awarded on April 28, 2026. Full description on SAM.gov.

Awarded tounder 133ND26CNB030008 (source: SAM.gov award notice)• $1.0M

Overview

Posted
May 6, 2026
Notice type
Award Notice
Set-aside
No Set aside used
NAICS
541713: Research and Development in Nanotechnology
Agency
Department of CommerceNATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY

Notice details

Office
DEPT OF COMMERCE NIST
Place of performance
Gaithersburg, Maryland, 20899
PSC
5961: SEMICONDUCTOR DEVICES AND ASSOCIATED HARDWARE
Last updated
Oct 30, 2026
First published
Last updated on SAM.gov
Award date
Apr 28, 2026
Award amount (SAM.gov award notice)
$1.0M

Identifiers

Solicitation number
133ND26CNB030008
Notice ID
17a64914677b438e91c8917bb33f18c3
Award number (PIID)
133ND26CNB030008

Description

This contract action was awarded fixed-price and non-competitive because only one source is capable of meeting NIST's requirements. 

Full description on SAM.gov

Award Overview

Award Number

133ND26CNB030008

Award Amount (SAM.gov award notice)

$1.0M

Award Date

Apr 28, 2026

Awardee

Awardee UEI

DMQNDJDHTDG4

Awardee CAGE Code

8H404

Awardee Address

Auburn, AL 36849, UNITED STATES

Original Solicitation

Notice ID: 17a64914677b438e91c8917bb33f18c3

Posted Date: May 6, 2026

Original Response Deadline: Not specified

Contract Details

Contract data not yet available

Contract details typically appear within 2-4 weeks after award; DoD awards are published about 90 days after signature.

Contacts

Contracting Officer

Primary Contact

Documents

No documents available.

Lifecycle

  1. 4
    Version 4Award NoticeArchivedCurrent

    Award Notice for Micro specimens of electroplated copper films and micro-sized lead-free solder for mechanical testing to fracture

    Notice 17a64914677b438e91c8917bb33f18c3 on SAM.gov

  2. 6
    Version 6JustificationArchived

    Type changed from Award Notice to Justification

    Sole Source Justification for Micro specimens of electroplated copper films and micro-sized lead-free solder for mechanical testing to fracture

    Notice b988b62e8b824f9281c9149643522405 on SAM.gov

Similar Opportunities

Additional Details

Solicitation Number

133ND26CNB030008

Archive Date

May 13, 2026

Office Address

GAITHERSBURG, MD, 20899