Software upgrade for flip chip bonders

Synopsis: 80NSSC24880475Q NASA/NSSC has a requirement for Software upgrade for FC150 and FC300 flip chip bonders. NASA/NSSC intends to issue a sole source contract to SET NORTH AMERICA, LLC 343 Meadow Fox LN Chester, New Hampshire 03036-4194 United States under the authority of FAR 13.106-1(b)(1)(i). It has been determined that SET NORTH AMERICA, LLC is the sole provider of Software upgrade for FC150 and FC300 flip chip bonders. NASA/NSSC will be the procuring center for this effort. Performance will be located at NASA/ Goddard Space Flight Center (GSFC). The Government intends to acquire commercial items and services using the provisions, clauses and procedures prescribed in FAR Part 12 and FAR Part 13. The NAICS Code for this procurement is 541519. Interested organizations may submit their capabilities and qualifications to perform the effort in writing to the identified point of contact not later than 3:00 p.m. Central Standard Time on 9/6/2024. Such capabilities/qualifications will be evaluated solely for the purpose of determining whether or not to conduct this procurement on a competitive basis. A determination by the Government not to compete this proposed effort on a full and open competition basis, based upon responses to this notice, is solely within the discretion of the government. Oral communications are not acceptable in response to this notice. NASA Clause 1852.215-84, Ombudsman, is applicable. The Center Ombudsman for this acquisition can be found at http://prod.nais.nasa.gov/pub/pub_library/Omb.html . Primary Point of Contact: Laura Quave Procurement Specialist laura.a.quave@nasa.gov 228-813-6420