Fifteen (15) TickDev Rev2 PCBs
Awarded on September 3, 2026. Full description on SAM.gov.
Overview
- Posted
- September 9, 2026
- Notice type
- Justification
- NAICS
- 334418: Printed Circuit Assembly (Electronic Assembly) Manufacturing
- Agency
- Department of WarDEFENSE MICROELECTRONICS ACTIVITY (DMEA)
Notice details
- Office
- DEFENSE MICROELECTRONICS ACTIVITY
- Place of performance
- Renton, Washington, 98057
- PSC
- 5998: ELECTRICAL AND ELECTRONIC ASSEMBLIES, BOARDS, CARDS, AND ASSOCIATED HARDWARE
- Last updated
- Oct 28, 2026
- First published
- Last updated on SAM.gov
- Award date
- Sep 3, 2026
- Award amount (SAM.gov award notice)
- Not specified
Identifiers
- Solicitation number
- HQ0727QSJ0002
- Notice ID
- b3469ebce8084d94bfa77ac696595e83
Description
The Defense Microelectronics Activity (DMEA) has awarded a follow-on order for fifteen (15) custom Printed Circuit Boards (PCBs) for the TickDev Rev2 requirement to an established Blanket Purchase Agreement (BPA) holder.
Please see attached sole source documentation.
Award Overview
Award Number
HQ072726FE106
Award Amount (SAM.gov award notice)
Not specified
Award Date
Sep 3, 2026
Awardee
Not specified
Original Solicitation
Notice ID: b3469ebce8084d94bfa77ac696595e83
Posted Date: Sep 9, 2026
Original Response Deadline: Not specified
Contract Details
Contract data not yet available
Contract details typically appear within 2-4 weeks after award; DoD awards are published about 90 days after signature.
Contacts
Contracting Officer
Primary Contact
Documents
Files (1)
- Download
PCB BPA Sole Source JA 26-6H9 Redacted.pdf
1.7 MBAdded in Justification version 3Posted
Lifecycle
- 3Version 3JustificationArchivedCurrent
Fifteen (15) TickDev Rev2 PCBs
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Additional Details
Solicitation Number
HQ0727QSJ0002
Archive Date
Oct 9, 2026
Office Address
MCCLELLAN, CA, 956522100