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Notice ID: 6ff893c1237d4a1f94a73d0dbd494c99Sources SoughtArchived

Semiconductor Die Bonding and Vacuum Packaging System

Archived on July 16, 2026. Original response deadline: . Full description on SAM.gov.

Overview

Response deadline
12:00 PM EDT
Posted
June 16, 2026
Notice type
Sources Sought
Agency
Department of WarDepartment of the Navy

Notice details

Office
ONR.ONR NRL.NAVAL RESEARCH LABORATORY
Place of performance
District of Columbia, 20375
Last updated
Oct 28, 2026
First published
Last updated on SAM.gov

Identifiers

Solicitation number
N00173-26-RFI-KN02
Notice ID
6ff893c1237d4a1f94a73d0dbd494c99

Description

NOTE: THIS IS NOT A SOLICITATION OR AN INDICATION THAT A CONTRACTUAL COMMITMENT WILL EXIST AS A RESULT OF THIS RFI. This Sources Sought Notice (SSN) is in support of market research and procurement planning being conducted by the Naval Research Laboratory (NRL), Washington, DC. This SSN is for informational and planning purposes only and does not guarantee that this will be competed via SAM.GOV. The Government assumes NO financial responsibility for any costs incurred. A solicitation package is not available at this time.

OBJECTIVE: The intent of this RFI is to gauge industry interest and search for potential sources capable of fulfilling a requirement for Semiconductor Die Bonding and Vacuum Packaging System in accordance with the attached draft specifications. The Government is currently in the planning stages for this procurement and may continue to modify the language within the requirement as necessary. These specifications do not necessarily represent the final specifications.

CONTRACTOR RESPONSE FORMAT: Interested parties, at a minimum, shall supply all of the below required information in a Capability Statement. (Reference RFI N00173-26-RFI-KN02 in your response)

1. CONTACT INFORMATION 

  a) Company Name and Address

  b) Point of Contact for question/clarification

  c) Telephone Number and e-mail address

  d) Unique Entity ID and CAGE Code  

  e) PSC Code of the proposed solution (SEE https://psctool.us)

  f) Business Size/Socioeconomic Categories

2. TECHNICAL INFORMATION:

a) List of capabilities/resources relevant to the attached specifications.

b.) Any questions/suggestions related to the Specifications

3. COMMERCIALITY OF PROPOSED ITEM

a) Whether item(s) offered/proposed is a commercial item and is customarily used by the general public or non-government entities for the other than Government purposes.

b) Whether the item has been sold, leased, or licensed to the general public, and if so, identify one or more such sales, leases, or licenses to document the commerciality of the item.

c) If the manufacturer of the component, please confirm if Authorized Resellers are available.

ADDITIONAL REQUIREMENT DETAILS:

Responses should be no more than 10 pages and should be emailed to the Contract Specialist at
kevin.nguyen3.civ@us.navy.mil; and to the Contrcting Officer at jamie.l.dixon8.civ@us.navy.mil. 

Full description on SAM.gov

Award Overview

Contacts

Contracting Officer

Primary Contact

Documents

Files (1)

  • Draft Specifications_N00173-26-RFI-KN02.pdf

    176 KBAdded in Sources Sought version 3Posted
    Download

Lifecycle

  1. 3
    Version 3Sources SoughtArchivedCurrent

    Semiconductor Die Bonding and Vacuum Packaging System

    Notice 6ff893c1237d4a1f94a73d0dbd494c99 on SAM.gov

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Additional Details

Solicitation Number

N00173-26-RFI-KN02

Archive Date

Jul 16, 2026

Office Address

WASHINGTON, DC, 20375-5328