Notice ID: 68c5094fd20d471388d9a1346950e9f7Award NoticeAwardedArchived
Semiconductor Die Bonding and Vacuum Packaging System
Awarded on September 14, 2026. Full description on SAM.gov.
Awarded tounder N0017326P2436 (source: SAM.gov award notice)• $673.0K
Overview
- Posted
- September 15, 2026
- Notice type
- Award Notice
- NAICS
- 333993: Packaging Machinery Manufacturing
- Agency
- Department of WarDepartment of the Navy
Notice details
- Office
- ONR.ONR NRL.NAVAL RESEARCH LABORATORY
- Place of performance
- Washington, District of Columbia, 20375
- PSC
- 3540: WRAPPING AND PACKAGING MACHINERY
- Last updated
- Oct 28, 2026
- First published
- Last updated on SAM.gov
- Award date
- Sep 14, 2026
- Award amount (SAM.gov award notice)
- $673.0K
Identifiers
- Solicitation number
- N0017326P2436
- Notice ID
- 68c5094fd20d471388d9a1346950e9f7
- Award number (PIID)
- N0017326P2436
Description
This contract is awarded to COOK AND WEIL, INC. under simplified procedures for certain commercial items included in FAR subpart 13.5 for Semiconductor Die Bonding and Vaccuum Packaging System.
Award Overview
Award Number
N0017326P2436
Award Amount (SAM.gov award notice)
$673.0K
Award Date
Sep 14, 2026
Awardee
Awardee UEI
GJMEHZQFN2D9
Awardee CAGE Code
0DW10
Awardee Address
Morganville, NJ 07751, UNITED STATES
Original Solicitation
Notice ID: 68c5094fd20d471388d9a1346950e9f7
Posted Date: Sep 15, 2026
Original Response Deadline: Not specified
Contract Details
Contract data not yet available
Contract details typically appear within 2-4 weeks after award; DoD awards are published about 90 days after signature.
Contacts
Contracting Officer
Primary Contact
KEVIN NGUYEN
Documents
No documents available.
Lifecycle
- 3Version 3Award NoticeArchivedCurrent
Semiconductor Die Bonding and Vacuum Packaging System
Similar Opportunities
Additional Details
Solicitation Number
N0017326P2436
Archive Date
Sep 29, 2026
Office Address
WASHINGTON, DC, 20375-5328