Notice ID: 35631225f1fb4b6185ea6fc0633a99d5JustificationAwardedArchived
J&A - Direct Bonding
Awarded on May 18, 2026. Full description on SAM.gov.
Overview
- Posted
- May 27, 2026
- Notice type
- Justification
- Agency
- Department of WarDepartment of the Army
Notice details
- Office
- AMC.ACC.ACC-CTRS.ACC-APG.W6QK ACC-APG
- Place of performance
- Fort Belvoir, Virginia
- PSC
- AC13: NATIONAL DEFENSE R&D SERVICES; DEPARTMENT OF DEFENSE - MILITARY; EXPERIMENTAL DEVELOPMENT
- Last updated
- Oct 29, 2026
- First published
- Last updated on SAM.gov
- Award date
- May 18, 2026
- Award amount (SAM.gov award notice)
- Not specified
Identifiers
- Solicitation number
- W56KGU26CA004
- Notice ID
- 35631225f1fb4b6185ea6fc0633a99d5
Description
Redacted J&A for Direct Bonding for Compound Semiconductor for Use in Dual Band Infrared Focal Plane Arrays.
Award Overview
Award Number
W56KGU26CA004
Award Amount (SAM.gov award notice)
Not specified
Award Date
May 18, 2026
Awardee
Not specified
Original Solicitation
Notice ID: 35631225f1fb4b6185ea6fc0633a99d5
Posted Date: May 27, 2026
Original Response Deadline: Not specified
Contacts
Contracting Officer
Primary Contact
Hanh Dinh
Documents
Files (1)
- Download
A02 - JA - Direct Bonding - Redacted.pdf
147 KBAdded in Justification version 3Posted
Lifecycle
- 3Version 3JustificationArchivedCurrent
J&A - Direct Bonding
Similar Opportunities
Additional Details
Solicitation Number
W56KGU26CA004
Archive Date
Jun 26, 2026
Office Address
ABERDEEN PROVING GROU, MD, 21005-1846