GovChime
UEI: MJGPRTAV5EU8 • CAGE: 7FL31

BOND TECHNOLOGIES INC (IN)

Registration and award facts

SAM.gov registration as of

Net obligations since FY2023
$995.05K
$995,054under this UEI
FY2026 obligations
$0
Provisional
Awards and orders
2
with positive net obligations
Latest action
Jan 20, 2026
SAM.gov registration
Active
Registration expiration date Sep 18, 2027

Registration

Entity structure
Corporate Entity (Tax Exempt)
Business start date
Jun 10, 2014 (12 years)
Location
Elkhart, IN
State of incorporation
Michigan
Purpose of registration
All Awards

† FY2026 obligations (provisional; DoD awards signed after Jul 24, 2026 are not yet public).

Source: SAM.gov entity registration and FPDS contract actions recorded under UEI MJGPRTAV5EU8. GovChime does not check exclusions.

Performance

Net obligations recorded under this UEI since FY2023. Top lists show the largest five by share of this vendor's net obligations; the shares do not sum to 100%.

Net obligations by fiscal year of action

  • FY2024: $849,096
  • FY2023: $145,958

Total across 2 fiscal years: $995,054

Top awarding agencies

Top awarding sub-agencies

Top NAICS by obligations

Top product and service codes by obligations

  • AJ14General science & technology r&d svcs; general science & technology; r&d administrative expenses$995,054, 100%

Capabilities

SBA certifications

No certification in the SBA profile data.

Contracts

Latest awards and orders

  1. 80NSSC24CA070Definitive contractNational Aeronautics and Space AdministrationLatest action
  2. 80NSSC23PB375Purchase orderNational Aeronautics and Space AdministrationLatest action

Contact Info

As of . Source: SAM.gov Points of Contact.

SAM.gov registration for BOND TECHNOLOGIES INC lists a physical address and a separate mailing address, along with 3 verified points of contact. Past Performance contacts are the recommended outreach channel for due-diligence references; Government Business contacts handle procurement-facing correspondence.

Source: SAM.gov entity registration. Contacts displaying numeric or placeholder names have been filtered (defense-in-depth).

Physical Address

1353 WADE DR STE B

ELKHART, IN, 46514

USA

Mailing Address

1353 WADE DR STE B

ELKHART, IN, 46514

USA

Government Business Contact

Timothy J Haynie

CEO

1353 Wade Drive

Suite B

Elkhart, IN, 46514

USA

Electronic Business Contact

Christopher J Taylor

Office Administratior

1353 Wade Drive

Suite B

Elkhart, IN, 46514

USA

Electronic Business Alternate Contact

Timothy J Haynie

CEO

1353 Wade Drive

Suite B

Elkhart, IN, 46514

USA

Additional Details

As of . Source: SAM.gov Entity Registration.

BOND TECHNOLOGIES INC has no active federal suspension or debarment on record in SAM.gov. Current SAM.gov registration expires September 18, 2027.

Source: SAM.gov entity registration (FAR responses, registration status). Always verify active exclusions against the authoritative record on SAM.gov before contract award.

Compliance & Risk Assessment

Source: SAM.gov FAR responses

Suspension/Debarment Status

SAM.gov registration reports no active exclusion

Public Display

Entity information is publicly displayed

Disaster Relief Registry

Not registered for disaster relief

EDI

Not declared in SAM.gov

Business Structure

Source: SAM.gov
Profit Structure:For Profit Organization
Organization:Subchapter S Corporation

Registration Details

Source: SAM.gov

Initial Registration

Jun 15, 2015

Last Update

Sep 30, 2026

Registration Activation

Active — Sep 21, 2026

Fiscal Year End

12/31

Country of Incorporation

USA

Congressional District

02