BOISE TECHNOLOGY INC. (ID)
Registration and award facts
SAM.gov registration as of
- Net obligations since FY2008
- $5.31M
- $5,306,820under this UEI
- FY2026 obligations
- $0†
- Provisional
- Awards and orders
- 3
- with positive net obligations
- Latest action
- Feb 24, 2014
- SAM.gov registration
- Inactive
- Registration expiration date Apr 19, 2017
Registration
- Entity structure
- Corporate Entity (Not Tax Exempt)
- Business start date
- Jan 25, 2005 (21 years)
- Location
- Nampa, ID
- State of incorporation
- Idaho
- Purpose of registration
- All Awards
- Website
- boisetechnology.org
† FY2026 obligations (provisional; DoD awards signed after Jul 26, 2026 are not yet public).
Contract actions that the Department of Defense both funds and awards are withheld at the source for 90 days, so DoD awards signed after Jul 26, 2026 are not yet public.
Source: SAM.gov entity registration and FPDS contract actions recorded under UEI WE7STL2WPWK3. GovChime does not check exclusions.
Performance
Net obligations recorded under this UEI since FY2008. Top lists show the largest five by share of this vendor's net obligations; the shares do not sum to 100%.
Net obligations by fiscal year of action
- FY2011: $1,239,120
- FY2010: $1,600,000
- FY2009: $899,340
- FY2008: $1,568,360
Total across 4 fiscal years: $5,306,820
Top awarding agencies
- Department of Defense$5,306,820, 100%
Top awarding sub-agencies
- Department of the Army$2,709,120, 51.0%
- Department of the Navy$2,597,700, 49.0%
Top NAICS by obligations
- 541710$2,597,700, 49.0%
Top product and service codes by obligations
- AH92R&d-other environment-a res/expl de$2,597,700, 49.0%
- AD41R&d-textiles,clothing,etc-b res$1,470,000, 27.7%
- AD42R&d-textiles,clothing,etc-a res/exp$1,239,120, 23.3%
Capabilities
NAICS codes
- 541712RESEARCH AND DEVELOPMENT IN THE PHYSICAL, ENGINEERING, AND LIFE SCIENCES (EXCEPT BIOTECHNOLOGY)(primary)
- 541711RESEARCH AND DEVELOPMENT IN BIOTECHNOLOGYSmall
Small: small business for that NAICS, self-certified in SAM.gov registration.
SBA certifications
No certification in the SBA profile data.
Product and service codes (PSC)
- AJ11R&D- GENERAL SCIENCE/TECHNOLOGY: PHYSICAL SCIENCES (BASIC RESEARCH)
Contracts
Latest awards and orders
- W911QY11C0056DcaDepartment of DefenseDepartment of the ArmyLatest action
- N0017807C3001DcaDepartment of DefenseDepartment of the NavyLatest action
- W911QY10C0091DcaDepartment of DefenseDepartment of the ArmyLatest action
Contact Info
As of . Source: SAM.gov Points of Contact.
SAM.gov registration for BOISE TECHNOLOGY INC. lists a physical address and a separate mailing address, along with 6 verified points of contact. Past Performance contacts are the recommended outreach channel for due-diligence references; Government Business contacts handle procurement-facing correspondence.
Source: SAM.gov entity registration. Contacts displaying numeric or placeholder names have been filtered (defense-in-depth).
Physical Address
5465 E TERRA LINDA WAY
NAMPA, ID, 83687
USA
Mailing Address
BOISE TECHNOLOGY
5465 E TERRA LINDA WAY
NAMPA, ID, 83686
USA
Government Business Contact
MICHAEL W Hill
President
BOISE TECHNOLOGY
5465 E TERRA LINDA WAY
NAMPA, ID, 83686
USA
Electronic Business Contact
MICHAEL W Hill
President
BOISE TECHNOLOGY
5465 E TERRA LINDA WAY
NAMPA, ID, 83686
USA
Past Performance Contact
Glenn Lawson
JSTO/DTRA-CB
8725 JOHN J. KINGMAN RD
FORT BELVOIR, VA, 22060
USA
Government Business Alternate Contact
Helaine Weissman
BOISE TECHNOLOGY
5465 E TERRA LINDA WAY
NAMPA, ID, 83686
USA
Electronic Business Alternate Contact
Helaine Weissman
BOISE TECHNOLOGY
5465 E TERRA LINDA WAY
NAMPA, ID, 83686
USA
Past Performance Alternate Contact
Richard Hodge
NSWC,DD
4045 HIGLEY ROAD
DAHLGREN, VA, 22448
USA
Additional Details
As of . Source: SAM.gov Entity Registration.
BOISE TECHNOLOGY INC. has no active federal suspension or debarment on record in SAM.gov. Current SAM.gov registration expires April 19, 2017.
Source: SAM.gov entity registration (FAR responses, registration status). Always verify active exclusions against the authoritative record on SAM.gov before contract award.
Compliance & Risk Assessment
Source: SAM.gov FAR responsesSuspension/Debarment Status
SAM.gov registration reports no active exclusion
Public Display
Entity information is publicly displayed
Disaster Relief Registry
Not registered for disaster relief
Bonding Information
No bonding information provided
EDI
Not declared in SAM.gov
Business Structure
Source: SAM.govRegistration Details
Source: SAM.govInitial Registration
Last Update
Registration Activation
Fiscal Year End
Country of Incorporation
Congressional District