HESSE MECHATRONICS, INC (CA)
Registration and award facts
SAM.gov registration as of
- Net obligations since FY2021
- $664.77K
- $664,771under this UEI
- FY2026 obligations
- $168.79K†
- $168,790Provisional
- Awards and orders
- 3
- with positive net obligations
- Latest action
- Jun 16, 2026
- SAM.gov registration
- Active
- Registration expiration date Mar 10, 2027
Registration
- Entity structure
- Corporate Entity (Not Tax Exempt)
- Business start date
- Apr 11, 2003 (23 years)
- Location
- Irvine, CA
- State of incorporation
- California
- Website
- hesse-mechatronics.com
† FY2026 obligations (provisional; DoD awards signed after Jul 25, 2026 are not yet public).
Contract actions that the Department of Defense both funds and awards are withheld at the source for 90 days, so DoD awards signed after Jul 25, 2026 are not yet public.
Source: SAM.gov entity registration and FPDS contract actions recorded under UEI D82USL6K1BJ3. GovChime does not check exclusions.
Performance
Net obligations recorded under this UEI since FY2021. Top lists show the largest five by share of this vendor's net obligations; the shares do not sum to 100%.
Net obligations by fiscal year of action
- FY2026: $168,790 (provisional)
- FY2022: $254,591
- FY2021: $241,390
Total across 3 fiscal years: $664,771
Top awarding agencies
- National Aeronautics and Space Administration$254,591, 38.3%
- Department of Defense$241,390, 36.3%
- Department of Commerce$168,790, 25.4%
Top awarding sub-agencies
- National Aeronautics and Space Administration$254,591, 38.3%
- Department of the Air Force$241,390, 36.3%
- National Institute of Standards and Technology$168,790, 25.4%
Top NAICS by obligations
- 333242Semiconductor machinery manufacturing$254,591, 38.3%
- 339113Surgical appliance and supplies manufacturing$168,790, 25.4%
Top product and service codes by obligations
- 5961Semiconductor devices and associated hardware$423,381, 63.7%
- 3670Specialized semiconductor, microcircuit, and printed circuit board manufacturing machinery$241,390, 36.3%
Capabilities
NAICS codes
- 333242Semiconductor Machinery Manufacturing(primary)Small
Small: small business for that NAICS, self-certified in SAM.gov registration.
SBA certifications
No certification in the SBA profile data.
Product and service codes (PSC)
- 5961Other Services/Supplies
- 6695Other Services/Supplies
- R425Professional, Administrative & Management Support
- R499Professional, Administrative & Management Support
- Z1NZMaintenance, Repair & Alteration of Real Property
Federal Capability Statement
Hesse Mechatronics, Inc develops and manufactures ultrasonic wire bonders for all wire dimensions as well as ultrasonic flipchip bonders in combination with standardized or customized automation solutions.The core competencies of the company are mechatronic systems, ultrasonic technology, control engineering and the detailed understanding and knowledge of the processes and physical effects relevant in ultrasonic joining technology. In order to maintain and expand technological leadership, we conduct intensive research and development in all aforementioned areas. For additional information and products go to hesse-mechatronics.com/
Capabilities & Services
Contracts
Latest awards and orders
- 1333ND26PNB030100Purchase orderDepartment of CommerceNational Institute of Standards and TechnologyLatest action
- 80GRC022P0004Purchase orderNational Aeronautics and Space AdministrationLatest action
- FA865021P0014Purchase orderDepartment of DefenseDepartment of the Air ForceLatest action
Contact Info
As of . Source: SAM.gov Points of Contact.
SAM.gov registration for HESSE MECHATRONICS, INC lists a physical address and a separate mailing address, along with 3 verified points of contact. Past Performance contacts are the recommended outreach channel for due-diligence references; Government Business contacts handle procurement-facing correspondence.
Source: SAM.gov entity registration. Contacts displaying numeric or placeholder names have been filtered (defense-in-depth).
Physical Address
3002 DOW AVE STE 308
TUSTIN, CA, 92780
USA
Mailing Address
3002 DOW AVE STE. 308
TUSTIN, CA, 92780
USA
Government Business Contact
ARIANA SANCHEZ
ADMINISTRATIVE MANAGER
3002 DOW AVE. STE. 308
TUSTIN, CA, 92780
USA
Electronic Business Contact
Ariana Sanchez
Administrative Manager
3002 Dow Ave Ste 308
Tustin, CA, 92780
USA
Government Business Alternate Contact
ARIANA SANCHEZ
ADMINISTRATIVE MANAGER
3002 DOW AVE STE 308
TUSTIN, CA, 92780
USA
Additional Details
As of . Source: SAM.gov Entity Registration.
HESSE MECHATRONICS, INC has no active federal suspension or debarment on record in SAM.gov. Current SAM.gov registration expires March 10, 2027.
Source: SAM.gov entity registration (FAR responses, registration status). Always verify active exclusions against the authoritative record on SAM.gov before contract award.
Compliance & Risk Assessment
Source: SAM.gov FAR responsesSuspension/Debarment Status
SAM.gov registration reports no active exclusion
Public Display
Entity information is publicly displayed
Disaster Relief Registry
Registered for disaster relief contracting — Nationwide
Bonding Information
No bonding information provided
EDI
Not declared in SAM.gov
Business Structure
Source: SAM.govRegistration Details
Source: SAM.govInitial Registration
Last Update
Registration Activation
Fiscal Year End
Country of Incorporation
Congressional District
Other contractors in California with primary NAICS 333242
- Suss Microtec IncCorona, CA
- Canon U.S.A., Inc.San Jose, CA
- PIE Scientific LLCUnion City, CA
- K&R Next Generation Bonding Inc.Santa Ana, CA
- Disco Hi-Tec America, IncSan Jose, CA
- Formfactor, Inc.Livermore, CA