AMERICAN SEMICONDUCTOR, INC (ID)
Registration and award facts
SAM.gov registration as of
- Net obligations since FY2008
- $11.62M
- $11,615,280under this UEI
- FY2026 obligations
- $744.23K†
- $744,231Provisional
- Awards and orders
- 13
- with positive net obligations
- Latest action
- Jul 13, 2026
- SAM.gov registration
- Active
- Registration expiration date Nov 12, 2026
Registration
- Entity structure
- Corporate Entity (Not Tax Exempt)
- Business start date
- Nov 13, 2001 (24 years)
- Location
- Boise, ID
- State of incorporation
- Id
- Website
- americansemi.com
† FY2026 obligations (provisional; DoD awards signed after Jul 29, 2026 are not yet public).
Contract actions that the Department of Defense both funds and awards are withheld at the source for 90 days, so DoD awards signed after Jul 29, 2026 are not yet public.
Source: SAM.gov entity registration and FPDS contract actions recorded under UEI C1BNR9HJBQK8. GovChime does not check exclusions.
Performance
Net obligations recorded under this UEI since FY2008. Top lists show the largest five by share of this vendor's net obligations; the shares do not sum to 100%.
Net obligations by fiscal year of action
- FY2026: $744,231 (provisional)
- FY2025: $940,474
- FY2022: $527,289
- FY2021: $627,027
- FY2019: $107,911
- FY2016: $603,929
- FY2014: $749,995
- FY2012: $649,281
Show all 11 yearsEarlier years (FY2009–FY2011)
- FY2011: $425,005
- FY2010: $3,230,280
- FY2009: $3,009,859
Total across 11 fiscal years: $11,615,280
Top awarding agencies
- Department of Defense$9,801,699, 84.4%
- Department of the Interior$1,684,705, 14.5%
- National Aeronautics and Space Administration$128,876, 1.1%
Top awarding sub-agencies
- Department of the Air Force$8,389,551, 72.2%
- Departmental Offices$1,684,705, 14.5%
- Department of the Army$1,262,226, 10.9%
- Missile Defense Agency$149,922, 1.3%
- National Aeronautics and Space Administration$128,876, 1.1%
Top NAICS by obligations
- 334413Semiconductor and related device manufacturing$3,950, <0.1%
Top product and service codes by obligations
- AC22R&d-missile & space sys-a res/expl$3,879,776, 33.4%
- AC23R&d-missile & space sys-adv dev$2,909,942, 25.1%
- AJ12General science and technology r&d services; general science and technology; applied research$1,684,705, 14.5%
- AC11R&d- defense system: aircraft (basic research)$1,499,964, 12.9%
- AN11Health r&d services; health care services; basic research$1,099,851, 9.5%
Capabilities
NAICS codes
- 334413Semiconductor and Related Device Manufacturing(primary)Small
- 334412Bare Printed Circuit Board ManufacturingSmall
- 541330E
- 541715E
Small: small business for that NAICS, self-certified in SAM.gov registration.
SBA certifications
No certification in the SBA profile data.
Federal Capability Statement
American Semiconductor serves the semiconductor and related industries as the leading developer and manufacturer of ultra-thin chip technology and manufacturing. The company invented and supplies Semiconductor-on-Polymer (SoP) wafer level chip scale packaging (WLCSP) for thin device applications that include, but are not limited to, chip-on-flex, protected fan-in, heterogeneous integration and multi-chip packaging. The company provides design, assembly, test and custom engineering services for thin-device technology. As an advanced packaging and assembly provider, American Semiconductor enables reliable high efficiency advanced packaging, assembly and test of thin electronics. Headquartered in Boise, Idaho, American Semiconductor operates a 9,000 square foot facility housing WLCSP fabrication, assembly and test operations.
Capabilities & Services
Contracts
Latest awards and orders
- 140D0425C0033Definitive contractDepartment of the InteriorDepartmental OfficesLatest action
- W81XWH21C0028Definitive contractDepartment of DefenseDefense Health AgencyLatest action
- W81XWH19C0166Definitive contractDepartment of DefenseDepartment of the ArmyLatest action
- NNJ16HH53PPurchase orderNational Aeronautics and Space AdministrationLatest action
- FA865014C5010Definitive contractDepartment of DefenseDepartment of the Air ForceLatest action
- FA865012M3219Purchase orderDepartment of DefenseDepartment of the Air ForceLatest action
- FA945311C0176DcaDepartment of DefenseDepartment of the Air ForceLatest action
- NNX12CE35PPoNational Aeronautics and Space AdministrationLatest action
- FA945310C0315DcaDepartment of DefenseDepartment of the Air ForceLatest action
- HQ014711C7512Definitive contractDepartment of DefenseMissile Defense AgencyLatest action
Contact Info
As of . Source: SAM.gov Points of Contact.
SAM.gov registration for AMERICAN SEMICONDUCTOR, INC lists a physical address and a separate mailing address, along with 5 verified points of contact. Past Performance contacts are the recommended outreach channel for due-diligence references; Government Business contacts handle procurement-facing correspondence.
Source: SAM.gov entity registration. Contacts displaying numeric or placeholder names have been filtered (defense-in-depth).
Physical Address
6987 W TARGEE ST
BOISE, ID, 83709
USA
Mailing Address
6987 W TARGEE ST
BOISE, ID, 83709
USA
Government Business Contact
LORELLI D HACKLER
CFO
AMERICAN SEMICONDUCTOR, INC.
6987 W. TARGEE STREET
BOISE, ID, 83709
USA
Electronic Business Contact
DOUGLAS R HACKLER
PRESIDENT & CEO
AMERICAN SEMICONDUCTOR, INC.
6987 W. TARGEE STREET
BOISE, ID, 83709
USA
Past Performance Contact
DOUGLAS R HACKLER
PRESIDENT & CEO
AMERICAN SEMICONDUCTOR, INC.
6987 W. TARGEE STREET
BOISE, ID, 83709
USA
Government Business Alternate Contact
DOUGLAS R HACKLER
PRESIDENT & CEO
AMERICAN SEMICONDUCTOR, INC.
6987 W. TARGEE STREET
BOISE, ID, 83709
USA
Electronic Business Alternate Contact
LORELLI D HACKLER
CFO
AMERICAN SEMICONDUCTOR, INC.
6987 W. TARGEE STREET
BOISE, ID, 83709
USA
Additional Details
As of . Source: SAM.gov Entity Registration.
AMERICAN SEMICONDUCTOR, INC has no active federal suspension or debarment on record in SAM.gov. Current SAM.gov registration expires November 12, 2026.
Source: SAM.gov entity registration (FAR responses, registration status). Always verify active exclusions against the authoritative record on SAM.gov before contract award.
Compliance & Risk Assessment
Source: SAM.gov FAR responsesSuspension/Debarment Status
SAM.gov registration reports no active exclusion
Public Display
Entity information is publicly displayed
Disaster Relief Registry
Not registered for disaster relief
Bonding Information
No bonding information provided
EDI
Not declared in SAM.gov
Business Structure
Source: SAM.govRegistration Details
Source: SAM.govInitial Registration
Last Update
Registration Activation
Fiscal Year End
Country of Incorporation
Congressional District
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