HYBOND, INC. (CA)
Registration and award facts
SAM.gov registration as of
- Net obligations since FY2008
- $240.73K
- $240,732under this UEI
- FY2026 obligations
- $0†
- Provisional
- Awards and orders
- 7
- with positive net obligations
- Latest action
- Jul 29, 2019
- SAM.gov registration
- Active
- Registration expiration date May 7, 2027
Registration
- Doing business as
- HYBOND INC
- Entity structure
- Corporate Entity (Not Tax Exempt)
- Business start date
- Apr 17, 1981 (45 years)
- Location
- Escondido, CA
- State of incorporation
- California
- Purpose of registration
- All Awards
- Website
- hybond.com
† FY2026 obligations (provisional; DoD awards signed after Jul 30, 2026 are not yet public).
Contract actions that the Department of Defense both funds and awards are withheld at the source for 90 days, so DoD awards signed after Jul 30, 2026 are not yet public.
Source: SAM.gov entity registration and FPDS contract actions recorded under UEI YK91A846N9X1. GovChime does not check exclusions.
Performance
Net obligations recorded under this UEI since FY2008. Top lists show the largest five by share of this vendor's net obligations; the shares do not sum to 100%.
Net obligations by fiscal year of action
- FY2019: -$1,332 (de-obligation)
- FY2018: $6,820
- FY2016: $25,920
- FY2015: $83,613
- FY2014: $23,292
- FY2011: $34,783
- FY2010: $65,333
- FY2009: -$4,696 (de-obligation)
Show all 9 yearsEarlier years (FY2008–FY2008)
- FY2008: $7,000
Total across 9 fiscal years: $240,732
Net de-obligation in that fiscal year (obligations withdrawn).
Top awarding agencies
- Department of Defense$238,429, 99.0%
- Department of Commerce$2,304, 1.0%
Top awarding sub-agencies
- Department of the Navy$144,316, 59.9%
- Department of the Air Force$72,153, 30.0%
- Department of the Army$21,960, 9.1%
- National Institute of Standards and Technology$2,304, 1.0%
Top NAICS by obligations
- 333242Semiconductor machinery manufacturing$131,493, 54.6%
- 333295Semiconductor machinery manufacturing$65,333, 27.1%
Top product and service codes by obligations
- 6640Laboratory equipment and supplies$105,573, 43.9%
- 3670Printed circuit board mfg mach$65,333, 27.1%
- 6650Optical instruments$34,783, 14.4%
- 5961Semiconductor devices and associated hardware$25,920, 10.8%
- J066Maint/repair/rebuild of equipment- instruments and laboratory equipment$6,820, 2.8%
Capabilities
NAICS codes
- 333242Semiconductor Machinery Manufacturing(primary)Small
- 811310Commercial and Industrial Machinery and Equipment (except Automotive and Electronic) Repair and MaintenanceSmall
Small: small business for that NAICS, self-certified in SAM.gov registration.
SBA certifications
No certification in the SBA profile data.
Product and service codes (PSC)
- 3670SPECIALIZED SEMICONDUCTOR, MICROCIRCUIT, AND PRINTED CIRCUIT BOARD MANUFACTURING MACHINERY
Federal Capability Statement
Manufacture, design & sale of manual & semiauto thermosonic wire, ribbon and ball bonders; TAB bonders; Semiautomatic Epoxy, Eutectic, Silverglass and laser diode die bonders; DFS universal bonder test units and heated workstages.
Capabilities & Services
Contracts
Latest awards and orders
- W911QX14P0511Purchase orderDepartment of DefenseDepartment of the ArmyLatest action
- FA860118P0257Purchase orderDepartment of DefenseDepartment of the Air ForceLatest action
- N0017316P0569Purchase orderDepartment of DefenseDepartment of the NavyLatest action
- N0016415P0628Purchase orderDepartment of DefenseDepartment of the NavyLatest action
- N0016411P0468Purchase orderDepartment of DefenseDepartment of the NavyLatest action
- FA283510P0097Purchase orderDepartment of DefenseDepartment of the Air ForceLatest action
- DOCSB134108SU0209PoDepartment of CommerceNational Institute of Standards and TechnologyLatest action
Contact Info
As of . Source: SAM.gov Points of Contact.
SAM.gov registration for HYBOND, INC. lists a physical address and a separate mailing address, along with 4 verified points of contact. Past Performance contacts are the recommended outreach channel for due-diligence references; Government Business contacts handle procurement-facing correspondence.
Source: SAM.gov entity registration. Contacts displaying numeric or placeholder names have been filtered (defense-in-depth).
Physical Address
330 STATE PL
ESCONDIDO, CA, 92029
USA
Mailing Address
330 STATE PL
ESCONDIDO, CA, 92029
USA
Government Business Contact
FELIX MAYORCA
330 STATE PLACE
Escondido, CA, 92029
USA
Electronic Business Contact
HANNS LINDBERG
PRESIDENT/CTO
330 STATE PLACE
Escondido, CA, 92029
USA
Government Business Alternate Contact
FELIX MAYORCA
330 STATE PLACE
ESCONDIDO, CA, 92029
USA
Electronic Business Alternate Contact
FELIX MAYORCA
330 STATE PLACE
ESCONDIDO, CA, 92029
USA
Additional Details
As of . Source: SAM.gov Entity Registration.
HYBOND, INC. has no active federal suspension or debarment on record in SAM.gov. Current SAM.gov registration expires May 7, 2027.
Source: SAM.gov entity registration (FAR responses, registration status). Always verify active exclusions against the authoritative record on SAM.gov before contract award.
Compliance & Risk Assessment
Source: SAM.gov FAR responsesSuspension/Debarment Status
SAM.gov registration reports no active exclusion
Public Display
Entity information is publicly displayed
Disaster Relief Registry
Not registered for disaster relief
Bonding Information
No bonding information provided
EDI
Not declared in SAM.gov
Business Structure
Source: SAM.govRegistration Details
Source: SAM.govInitial Registration
Last Update
Registration Activation
Fiscal Year End
Country of Incorporation
Congressional District
Other contractors in California with primary NAICS 333242
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- PIE Scientific LLCUnion City, CA
- K&R Next Generation Bonding Inc.Santa Ana, CA
- Disco Hi-Tec America, IncSan Jose, CA